A trend that is gathering steam -- more and more designers are demanding "off-the-shelf" embedded computer on module solutions to help them match the varying needs of specialized applications. But, there are many different Computer-on-Modules solutions out there. Let me help you wade through the growing array of Computer-on-Modules standards so you can discover the "right" fit for your application. .
For designers who have worked with them before, Computer-on-Modules have been proven to be ideal for a broad range of embedded applications, particularly in ones where other form factors such as add-on cards cannot be used. That's because system expansion and customization can be implemented on an application-specific carrier board. Together, the Computer-on-Module and carrier board deliver the functionality of a single-board computer. To learn more about Computer-on-Modules methodology, I recommend checking out the Computer-On-Modules Magazine.
To give you a quick history, the first open standard Computer-on-Module was the DIMM-PC with ISA bus. Then came the Embedded Technology eXtended (more commonly referred to as ETX) standard which was developed to provide an open standard to meet the needs of embedded industrial applications with PCI and ISA.
The ETX standard has evolved further with enhanced scalability and performance, the new ETX 3.0 specification offers all of the benefits of the original ETX standard while adding in 2x Serial ATA connectors without changing any of the ETX pins -- making new modules 100\% pin-to-pin backward compatible. Now, this is the long-term support that designers were waiting for the medical, gaming and entertainment, military and aerospace markets. The full ETX 3.0 specification is downloadable as well.
Even though ETX 3.0 modules offer considerable advancements now available from multi-core technologies, they don't offer PCI Express. Although other Computer-on-Modules, such as XTX, venture into this area, they are not backward compatible with ETX Computer-on-Modules thus requiring carrier board redesign. Additionally, they don't offer a lot of flexibility for more future technologies. That's where COM Express enters the scene.
High end applications that require high performance need the computing power provided by the COM Express open standard controlled by PICMG. By providing a new level of form, fit and function, COM Express modules help minimize current and future design risks. COM Express solutions allow the application of high-speed Computer-on-Modules for PCI Express Bus and PCI Express chipsets. These new solutions utilize 220-pin high-speed SMT connectors to deliver enormous performance capabilities. In addition, solutions based on COM Express offer almost twice the performance at the same frequency and generates comparable waste heat even in Computer-on-Modules that use the Intel® CoreTM Duo and CoreTM 2 Duo processors paired with the Intel® 945GM, GM965 and 3100 chipsets. For a PICMG-approved discussion about the origins of COM Express, check out the .
Recently, new Computer-on-Modules have been added to the landscape based on the Intel® Atom Z5xx series of processors. So that designers do not need to engage in unnecessary carrier board redesign, the nanoETXexpress COM Express compatible module specification (downloadable and review the spec for yourself) has been introduced by Kontron and is being proposed to PICMG as the approved compact implementation of the COM Express pin-out Type 1. An example is the Kontron nanoETXexpress-SP. This module should be good news for designers who are faced with the barriers due to size, performance issues or power consumption limitations. It's one less worry when application compatibility and expandability is ensured by adherence to PICMG Computer-on-Module standards.
What are your thoughts on the different Computer-on-Module standards that take advantage of new multi-core capabilities and how have they worked for you?
Christine Van De Graaf
Product Marketing Manager, Embedded Modules Division