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Our final course of the day is a look at just what benefits Intel Atom processors have for embedded computing:


This course covers two Intel® Atom processor-based platforms for embedded computing -- based on either the Intel®® Atom™ processor N270.   We will discuss the differences between the two platforms, provide an overview of the power savings technologies of the Intel Atom processor, review the feature set and I/O capabilities of the chipsets, including graphics, and discuss additional supported technologies (SSD, wireless and wired Ethernet). Atom processor Z5xx series or the Intel

Presented by Robin R. Lowther, Technical Marketing Engineer, Embedded and Communications Group, Intel Corporation

Robin is a Technical Marketing Engineer in the Embedded and Communications Group at Intel Corporation. He received his BSEE from the ITT Technical Institute of Seattle and has been with Intel for 13 years. He's now supporting Intel® Atom products as a Technical Marketing Engineer for the LEPD Division within the ECG Embedded group.


This post's comments can be used as an open discussion thread for Robin's presentation.

Starting right about now is the next to last course of the day, one that is designed to help you find the Intel embedded product that best fits your needs:


This course will help customers identify the best Intel embedded scalable and low power products and platforms to meet their specific application requirements. It will communicate overall product line positioning showing a progression of features, platform benefits and value propositions with simple platform SKU positioning based on customer application.

Presented by Ryan Brown, Embedded and Communications Group, Intel Corporation

Ryan Brown has worked for Intel since 2000. He is currently a Product Line Manager in the Embedded Computing Division, under the Embedded and Communications Group. In his current role, Ryan works with customers and to define platform line requirements for next generation Low Power products, develop launch plans and establish products into Embedded Markets. Ravi Sirigineedi has worked for Intel since 1999. He is currently a Product Line Manager in the Embedded Computing Division, under the Embedded and Communications Group. In his role Ravi manages the current generation platforms in the Scalable product line and establishes products into the Embedded Market Segments.

Ravi Sirigineedi, Embedded and Communications Group, Intel Corporation
Ravi Sirigineedi has worked for Intel since 1999. He is currently a Product Line Manager in the Embedded Computing Division, under the Embedded and Communications Group. In his role Ravi manages the current generation platforms in the Scalable product line and establishes products into the Embedded Market Segments.


This post can be used, via the comments, to discuss the topics covered by Ryan and Ravi.

Next to take the stage in the Embedded eVent's Auditorium is a course on intelligent video. Here's the overview:


This course will provide a straightforward view into this fascinating software segment, including what it really is; its real-world industry applications; how it's used today for business intelligence, digital signage and building management needs; and how it works within the Intel® architecture environment. Presented by ObjectVideo®, an industry recognized leader in intelligent video, the focus of the session will be on how this technology can be most effectively deployed as a high-value ingredient within a larger video solution. Topics addressed will include importance of solution flexibility; common software and protocols for innovation plus improved video analytic performance; and the significance of platform manageability and ecosystem to the end user.

Presented by Edward Troha, Managing Director, Global Marketing, ObjectVideo, Inc.

Ed Troha is Director of Global Marketing for ObjectVideo, the global leader in the video analytics software space. His role there is twofold: While being responsible for ObjectVideo’s brand, strategic messages and market positioning, he is equally responsible for the development of comprehensive OEM and Technology Partner programs that easily enable partners to include ObjectVideo technology in a wide variety of end user environments. He is particularly focused on how intelligent video can be more effectively leveraged in the critical infrastructure, retail, transportation and banking areas. In addition to his strong creative abilities, he brings more than 20 years of direct sales and marketing experience in technology products and services.


Use this post as a conversation thread for discussing the session and its content.

The first post-lunch course during today's event is The value of Intel® Architecture in Digital Signage. Here's the program:


Digital Signage is a new and emerging embedded market segment with tremendous potential for advertisers and end customers. This presentation will provide an overview of the market opportunity, usage models and applications. The presenter will show how Embedded Intel Architecture’s scalable roadmap in combination with Intel’s ecosystem (Software vendors, board vendors, integrators, etc) can simplify the implementation of Digital Signage applications accelerating the time to market for OEMs and end users.

Presented by Jose Avalos,
Digital Signage Director, Embedded and Communications Group, Intel Corporation
Jose Avalos is the Director of Digital Signage at Intel's Embedded Computing Division (ECD). Previously, Jose was the General Manager for the Ultrawideband Networking Operation at Intel's New Business Initiatives organization. He is a 22 years veteran of the Semiconductor Industry with the last 20 years at Intel. He has held various General Management and director level positions at Intel in Marketing and Sales, Systems Engineering and Platform Engineering. He helped drive Intel’s first platforms in In-Car Computing, Ultraportable Notebooks, Analog Set-Top Boxes, Web Appliances, Digital TV and Print Imaging. Jose has a BSEE from the University of Illinois at Champaign-Urbana and a MSE from Arizona State University.


The course takes place from 1 - 2PM Pacific in the Auditorium. You can use this post as an open thread for discussion about Jose's course and the issues discussed.

We're going to leave this as an open thread for the next session of the day. Here's an overview:


The embedded industry has hit an inflection point. Next generation systems need to deliver more performance, be smaller and more efficient and on top of that innovative. Multi-core processors combined with virtualization technology provide device developers with the tools to deliver this next generation of devices. Understanding and mastering these techniques will be crucial to be able to compete in the embedded marketplace. This course will provide the base for understanding multi-core benefits, the configurations that come with them as well as when to use these configurations and how to develop for them.

Presented by Mark Hermeling, Sr. Product Manager, Virtualization, Wind River

Mark is a Senior Product Manager with Wind River focusing on multicore and virtualization solutions. Prior to joining Wind River, Mark has helped development teams build embedded systems across Asia, Europe and North America in automotive, telecom, consumer electronics and defense industries.


With the chat functionality being...wonky...feel free to leave your comments and questions here. Mark is on-hand for your questions and feedback so use the comments to communicate with Mark. We'll update this post with anything interesting and informative.


What’s Missing from Qseven?

Posted by Felix_M May 12, 2009

As existing standards evolve, there's more of a tendency to drag along support for the legacy features found in earlier versions.  Backwards compatibility has always been an admirable goal.  But when a completely new standard arrives on the scene, the age-old expression is often true, "out with the old, in with the new."  Even though the technology has already been developed, continuing to support older functionality does carry a burden.  It might take up some precious real estate and add a few cents to the BOM.  But even if doesn't, one has to at least factor in the time and costs associated with testing it.  That's why the architects of the new Qseven Computer-on-Module (COM) standard decided to part with some legacy "baggage."


If you're not already familiar with it, Qseven's name stems from its Quadratic (i.e. square) 7 x 7 cm (2.75 x 2.75-inch) format.  Qseven targets low power, ultra-portable platforms, including handheld devices deploying 45nm processors such as Intel® Atom.  Starting off my list of "what's missing," compared with most previous COM standards Qseven drops an expensive board-to-board connector, instead utilizing the cost effective "golden finger" connector borrowed from the MXM (Mobile PCI Express Module) graphics interconnect standard used in laptops.  Curiously enough, I bumped into at least one manufacturer's COM that has adopted not only the MXM connector but conforms to the full MXM format.  It doesn't have an Intel processor, though.    


Other things you'll find missing are the fan and the power cord.  Actually the standard doesn't prohibit either but it does specify 5V power with maximum dissipation of 12 watts.  The point is you probably won't need a fan and Qseven modules will likely find their way into many battery powered devices, for which the spec. defines battery management guidelines.  For reference, note that the Intel® Atom Z5xx processor series combined with the US15W System Controller Hub (SCH) chipset has a sub 5 watt TDP.


As for reduction in footprint, critics will argue that the existing 5.5 cm x 8.4 cm nanoETXexpress module is already a bit smaller, so Qseven doesn't appear to offer any new advantage purely on the basis of size.   




                 Qseven footprint vs. nanoETXexpress


Deleting some cost and fans and power cords are all good things.  Is there anything left out of Qseven that systems designers will miss?  The founding fathers of Qseven decided to support only "the feature set of current and future mobile chipset/CPU combinations."   Therefore older interfaces, such as Parallel IDE and PCI Bus, have been deliberately omitted. 


On the "in with the new" side of the equation, Qseven incorporates modern fast serial differential interfaces, including PCI Express and Serial ATA; graphics panel and digital media specs such as DisplayPort and HDMI; and claims to be the first COM standard to support SDIO which, among other benefits, will enable cheaper bulk memory than CompactFlash.  


Legacy features not supported

Modern interfaces added

  • Parallel IDE
  • PCI bus
  • PCI Express
  • SATA
  • DisplayPort
  • HDMI
  • SDIO


Click here to check out a short video presenting the highlights of Qseven, or visit for the complete specifications and for list of member companies in the standards consortium, many of which are members of the Intel® Embedded and Communications Alliance.  You'll also find within our community several available products in the Qseven form factor featuring Intel® Atom processors. 


As a future-looking COM standard for low power, ultra-portable devices, do you see anything missing from Qseven?




J. Felix McNulty

Community Moderator

Intel® Embedded Design Center Community

(Intel contractor) 

Message Edited by Felix_M on 05-12-2009 11:10 AM

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