System developers and their customers are always looking for easy ways to increase system performance. The introduction of a new processor family can involve significant system redesign forcing customers to wait longer for the performance boost and system manufacturers to invest greater resources in a new system development. The latest Intel® Xeon® processor E5-2600 v2 family delivers significant performance enhancements including additional processor cores within the existing power budget (TDP) and are plug-in replacements for the previous generation. The result is a performance upgrade that requires little investment beyond requalification of the system for specific applications.

 

In this blog I am going to explore opportunities to upgrade your solutions to take advantage of the Intel Xeon processor E5-2600 v2 family without major development costs. For this blog I am using implementation examples from Associate members of the Intel® Intelligent Systems Alliance DFI, Emerson and Hewlett-Packard (HP).  The 250-plus members of the Alliance collaborate closely with Intel to create hardware, software, tools, and services to help speed intelligent systems  to market.

 

Intel® Xeon® Processor E5-2600 v2 Product Family

 

The 22nm Intel Xeon processor E5-2600 v2 product family introduced in September 2013 delivers increased performance of up to 45% on previous generations.  The product family for embedded applications includes eight Intel Xeon processor E5-2600 v2 with 4, 6, 8 or 10 cores and up to 20 threads. The processors have four memory channels supporting up to 59.7 GB/s total memory bandwidth and integrate significant cache memory with 25MB in 10 core devices.

 

The Intel Xeon processor E5-2600 v2 integrates two QPI links supporting dual processor configurations and each processor has 40 PCI Express Rev 3.0 lanes that can be configured into x4, x8 or x16 ports. This gives system designers significant scope to support high-speed networking and other interfaces. The Intel Xeon processor E5-2600 v2 family shares the same FCLGA2011 package with the previous generation and max TDP is 50W, 70W, 80W, 95W or 115W, making these processors ideal for many embedded applications.

 

Embedded Motherboard

 

The RL830-C602/C604 embedded motherboard from DFI shown in Figure 1 is available with 6, 8 or 10 core Intel Xeon processor E5-2600 v2. The motherboard integrates dual processors, Intel® C602J/C604 Chipset and sixteen 240-pin DDR3 memory sockets supporting up to 512GB system memory with ECC.

DFI RL830.jpg

Figure 1. DFI RL830-C602/C604 Motherboard

 

A key feature of the DFI RL830-C602/C604 motherboard is support for four PCI Express x16 expansion slots and two PCI Express x8 expansion slots. This configuration makes maximum use of the 40 PCI Express lanes on each processor. The six PCI Express expansion slots can be used for high-speed graphics and video applications such as machine vision inspection motion capture and for high speed networking interfaces including 10 Gigabit Ethernet network interface cards (NIC). The DFI RL830-C602/C604 motherboards will be available from October 2013.

 

ATCA

 

ATCA is an open platform for computing and telecommunications applications. The latest systems support 40Gbps backplanes and up to 14 processor blades with two switch blades. The Emerson ATCA-7475 blade shown in Figure 2 integrates dual Intel Xeon processors E5-2600 v2. This new blade delivers a price/performance increase on previous generations with 4 additional processor cores and the same system power.

Emerson ATCA-7475.jpg

Figure 2. Emerson ATCA-7475 Blade

 

The Emerson ATCA-7475 blade integrates dual 40 Gigabit Ethernet switch interfaces and Intel® Communications Chipset 89xx. The blade will support up to 128GB system memory with ECC. The Emerson ATCA-7475 blade and ATCA platforms are being used in a wide range of networking and computing applications.

 

The Emerson ATCA-7475 blade supports high speed networking interfaces through the optional rear transition module (RTM). RTMs are available to support up to six Gigabit Ethernet interfaces and up to six 10 Gigabit Ethernet interfaces as well as two SAS hard drives. The blade also supports an optional module with dual Intel® Communications Chipset 8920 with hardware acceleration for Intel® QuickAssist Technology. Each Intel Communications Chipset 8920 device will support up to 20Gbps of security processing, significantly accelerating applications requiring this functionality.

 

Rack Mount and Blade Servers

 

Figure 3 shows two standard server solutions from HP that already support the Intel Xeon processor E5-2600 v2 family. The HP ProLiant DL380p Gen8 Server  is a 2U rackmount server with dual sockets and memory speeds up to 1866MHz. The server has 24 memory slots supporting up to 768GB DDR3 memory. The ProLiant DL380p Gen8 Server  is available with a wide range of processor and memory configurations and optional quad Gigabit Ethernet interface card or dual 10 Gigabit Ethernet card.

HP DL380p BL460c Small.jpg

Figure 3. HP ProLiant DL380e Rack Mount Server (left) and BL460c Blade Server (right)

 

The HP ProLiant BL460c Blade Server is a dual processor module for c3000 or c7000 HP BladeSystem blade servers. The module integrates one or two Intel Xeon processor E5-2600 v2 with up to 12 cores each. The HP BL460c Blade Server supports up to 512MB DDR3 memory with sixteen slots. Both the HP DL380e Rack Mount Server (left) and BL460c Blade Server are used in a wide range of computing and networking applications.

 

Rapid Upgrade

The Intel Xeon processor E5-2600 v2 family offers a significant performance upgrade with limited investment for system developers and their customers. The examples shown in this blog are a small selection of the systems and building blocks already available with Intel Xeon processor E5-2600 v2 family, which delivers a rapid upgrade on previous generations.

 

Learn More

Contact Featured Alliance Members:

 

Solutions in this blog:

 

Related topics:

 

DFI, Emerson and Hewlett-Packard are Associate members of the Intel® Intelligent Systems Alliance.

 

Simon Stanley

Roving Reporter (Intel® Contractor), Intel® Intelligent Systems Alliance

Principal Consultant, Earlswood Marketing

Follow me on Twitter: @simon_stanley