COM Express technology now can be deployed into rugged applications previously thought impossible.
This paper discusses the challenges of designing a COM Express module, specifically the GE Intelligent Platforms bCOM2-L1100, for deployment in harsh environments of temperature extremes, shock and vibration.
Most COM applications are in areas where environmental stress levels are low. Typically, applications are found in a protected environment where the temperature range is moderate, there are no shock and vibration stresses, and no material contamination (i.e. fungus, dust, sand, and moisture).
To withstand these harsh environmental forces, special care must be taken during the initial design concept, testing phase, and qualification process to achieve targeted levels. Numerous factors, including component selection and coating methods, play a vital role in positively influencing the operational capabilities of the module.