congatec White Paper:  Fanless Quad-Core Modules with 3rd Gen Intel® Core™ processors

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    The 3rd generation of Intel® Core™ processors not only shrinks the manufacturing process from 32 to 22nm but also uses a new technology with 3D tri-gate transistors. This allows for smaller die sizes reducing the cost of manufacturing and increasing power efficiency by up to 25%. The new integrated Intel® HD4000 graphics, which features 16 instead of 12 parallel processing cores, offers about 40% more processing power and supports up to three independent high-definition displays.


    To really take advantage of the whole performance benefits, it is important to account for the fact that the significantly smaller die surfaces compared to previous processor generations lead to an increase in heat density and cause severe enclosure hot spots. A smart cooling technology is required to ensure that the turbo boost is not lost through local overheating.


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