To keep up with exploding demand, operators need to quickly and cost-effectively transition from 3G to LTE. Operators are also looking to support Heterogeneous Networks (HetNets) comprised of macro cells, small cells and cloud-based base stations to supplement their primary networks.
To support this new vision of network architecture, telecom equipment manufacturers (TEMs) need scalable solutions that accommodate varying loads and different equipment sizes. TEMs can meet these requirements with the Intel® Platform for Communications Infrastructure, which scales from <1 Gbps to 80 Gbps. By combining this platform with turnkey LTE eNodeB (eNB) software, TEMs can significantly simplify development and rapidly deliver a full range of LTE solutions to market. To see how, check out Radisys’ article in the latest Embedded Innovator newsletter.
Radisys Trillium LTE eNodeB leverages multi-core Intel® architecture (IA) technology.
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For more on consolidating communications workloads onto a single architecture, see intel.com/go/embedded-consolidation
Radisys is a Premier member of the Intel® Embedded Alliance.
Roving Reporter (Intel Contractor), Intel® Intelligent Systems Alliance
Editor-In-Chief Embedded Innovator magazine
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