WhitePaper_MSC_COMe.pdf

Version 1

    Whitepaper: New High-performance Embedded Computing Modules

    Third generation Intel ® Core™ processors bring enhanced CPU, graphics and video performance, while at the same time reducing overall power consumption. New COM Express™ Type 6 modules enable these processors to support new high speed serial interfaces and enhanced digital display features for next generation embedded products. This white paper provides a close look into the advantage of the new PICMG COM Express™ Type 6 standard, insight into Intel’s processor architecture, and a short description of MSC’s embedded platforms and design-in support.