Axiomtek CEM501 is a COM Express type 6 compact module with 6th generation Intel® Core™ i7/i5/i3 processors (formerly codename: Skylake). The 95 x 95 mm system-on-module comes with DDR4-2133 SO-DIMM supporting up to 32 GB system memory and is designed for the extended temperature range from -40°C to +85°C. The compact-sized industrial-grade COM Express type 6 module supports three independent UHD/4K displays with Intel® Gen 9 graphics, making it ideal for image-intensive applications in automation, medical, and infotainment and IIoT related applications.
Axiomtek CEM501 is designed to lower development costs and reduce time to market. With 6th generation Intel® Core™ processor onboard, the high-performance COM Express type 6 module offers compact design with stunning graphics performance and fast computing power at attractive price points. The power-efficient system on module is built to withstand industrial grade wide temperature conditions for applications required superior data transfer capability and advanced computing power in a rugged environment.
The Axiomtek powerful Skylake-U Intel® Core™-based CEM501 provides LVDS, VGA (optional) and two DDI ports supporting HDMI/DVI/DisplayPort, and optionally an embedded DisplayPort (eDP) is also available. The small form factor type 6 computer-on-module embedded board also provides high-bandwidth I/O, including six PCIe x1 Gen. 3.0, three SATA-600 interfaces, one Gigabit LAN port, four USB 3.0 ports, eight USB 2.0 ports, and 4-IN/OUT DIO for peripheral devices and data transfer. The LPC bus is available for easy connection of legacy I/O interfaces. The industrial embedded module runs on +12V or +5V SB power with both AT and ATX modes. For evaluation and development purposes, Axiomtek also provides CEB94006, the carrier board to operate with CEM501 for supporting rich I/O and expansions interfaces. This powerful COM Express type 6 compact embedded board runs under Windows® 7/8.1/10 and Linux operating system and supports Axiomtek AXView 2.0, intelligent remote management software.
- COM Express Compact Type 6 module
- 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-U)
- 2 DDR4-2133 SO-DIMM sockets support max. up to 32 GB
- Max. up to 6 lanes of PCI Express
- 3 SATA-600 interfaces, 4 USB 3.0 and 8 USB 2.0 ports
- Industrial-grade wide range operating temperature from -40°C to +85°C
- Intelligent remote management software AXView 2.0 supported