XMC-121 Rugged Intel Skylake Xeon XMC SBC offers extremely powerful x86 processing with a low power and small sized footprint

Version 2

    Designed for space-constrained size, weight and power (SWaP)-sensitive programs, the Curtiss-Wright XMC-121 small form factor Intel Xeon-based Single Board Computer (SBC) offers extremely powerful x86 processing with a low power and small sized footprint. The XMC-121 incorporates Intel’s 6th Gen Xeon technology using the Skylake Mobile Xeon E3-1505L processor. The processor provides quad-core, dual threading performance operating at 2.0 GHz with turbo operation to 2.8 GHz. With an integrated 8 MB L2 Intel Smart Cache and featuring Intel Virtualization and vPro Technologies, the E3-1505L processor provides 64-bit high performance processing while consuming under 25 watts of power. The processor is coupled to a dual-channel 64-bit DDR4 memory system with ECC, supporting up to 16 GB of high speed system memory operating at 2,133 MT/s and providing 34.1 GB/s memory performance. The XMC-121 includes two gigabit Ethernet (GbE) ports, supporting tri-speed 10/100/1000Base-T and 1000Base-X (SerDes) connectivity. One serial RS-232, one RS-422/485 port supporting up to 1.5 Mbps interface speeds, one USB 2.0 and one USB 2.0/3/0 port, one SATA 3.0 port and four discrete digital I/O signals are provided for external connectivity.




    Key FeaturesApplications
    • Intel Skylake Mobile Xeon E3-1505L Processor XMC SBC
    • Quad-core, dual thread @ 2.0 GHz
    • Up to 32 GB DDR4 with ECC
    • Up to 32 GB SATA NAND flash
    • Dual Gigabit Ethernet ports
    • Serial RS-232, serial RS-422/485,dual USB, SATA and DIO ports for external connectivity
    • Dual SPI and I2C signals for local expansion
    • DVI/DisplayPort with integrated Intel HD P530 graphics
    • Low power with configurable power settings
    • Supports Linux, VxWorks and Microsoft Windows
    • Rugged air and conduction-cooled versions
    • XMC mezzanine processor for rugged embedded applications
    • Micro-server and virtualization capabilities
    • Co-processor for high density processing
    • Ultra-small processor for SWaP constrained applications



    Download the press release to learn more.