Defense application requirements are broad and often mission environments are extreme. Leveraging Commercial Off the Shelf (COTS) technologies, and in particular Intel® Xeon® server class multi-core processing engines, provides solution designers myriad options for a wide range of application implementations. Time proven embedded system engineering design practices confirm that meeting requirements by creating designs with reduced complexity ultimately result in higher reliability, better quality and lower overall life cycle costs. The designer’s choice of Xeon family processor type, a XEON E5 or the XEON D System on Chip (SoC) device, can have has wide reaching impact to size, weight, power and cost (SWaP-C), module and sub-system complexity and overall reliability.
This white paper by Curtiss-Wright identifies many considerations and trade-offs that are critical to consider before a Xeon processor type is chosen. It identifies module and subsystem impacts based on the selection process identifying why the selection decision should not be made purely on TFLOPS/slot but rather overall architectural sub-system optimization. Curtiss-Wright CHAMP-XD OpenVPX family of products based on the Xeon-D are then identified and SWaP-C characteristics highlighted. Conclusions are summarized identifying the considerations and solution impact of processor type selection for current and next generation defense applications.
Download this Intel Xeon Processor Family Choice for Embedded Solutions Processor Impacts SWaP-C, Overall Complexity and Reliability white paper to learn more about
- Intel Xeon Processor family comparisons
- Processor selection criteria trade-offs
- Module design complexity considerations
- Creating balanced and high reliability solutions
- Curtiss-Wright CHAMP-XD1 3U VPX DSP Card, CHAMP-XD2 6U OpenVPX DSP Card and CHAMP-XD2M 6U OpenVPX DSP Card with high memory capacity products