Carbon footprints are top of mind issues everyone is trying
to stay “green” and use less power. We may see less air conditioning on
manufacturing floors this summer, subjecting industrial PC equipment to
higher levels of heat and humidity from the environment then expected. Military,
automotive and outdoors electronics custom solutions equipment
are traditionally designed to withstand the most grueling environments. Will
other systems need improved thermal designs as we battle global warming?
Whatdo you think?
Kontron system design engineers have a long history of predictinga system’s
airflow needs with thermal modeling, ensuring a margin of headroom for the
most taxing deployments, or unanticipated changes such as a change in
the air conditioning levels during operation. Kontron’s analyses determines the
best combination of passive and active cooling for the configuration of processor,
chipset, graphics engine and add in cards for an anticipated environmentalsituation.
A combination of fans, heat sinks and fins can be used to support robustcooling
of server processor systems, while new power sipping processors, such as Intel’s
Atom processor, will not need fans in most system deployments. SinceKontron
latest cost effective technologies areconsistently used in the total design process.
Kontron would like to know what you think of the newerthermal management
technologies,such as nano technologies using thin film thermoelectric, micro-channel
cooling technologies, liquid cooling and foamed graphite use. Which
technologies do you think will make it and why?
How “green” are the new technologies?
Kontron -- Nancy Pantone