Upgrade your Embedded System with DFI’s 6th Gen Intel Core Processor-based COM Express Type 6
DFI, a leading provider offering a wide range of embedded products for industrial applications, today introduces its latest three COM Express Type 6 modules powered by the 6th Generation Intel® Core™ processor family (codename Skylake), including Intel® Mobile-based Basic – SH960-QM170 and SH960-HM170, and U series SoC-based Compact – SU968. The Mobile-based modules features enhanced graphics performance and high computing while ULT-based module features low power and fanless design making them well suited for industrial application in gaming, medical, digital signage, and factory automation.
The Mobile-based Module with High-Performance Graphics for Gaming Application With more and more requirements in the gaming market, gaming machine manufacturers continue to search for the right solution to obtain rich immersive graphics and performance that end users come to expect today. Aimed at the application, DFI developed COM Express Basic based on mobile platform featuring super-fast 2133 DDR4 memory up to 32 GB for faster data transfer and 3 independent displays with high resolution (HDMI/DP++/eDP supports up to 4K x 2K) for greater gaming experience.
The ULT-based Module with High-Resolution Output and Low Power Design for Ultrasound Application Ultrasound imaging devices are widely used in tumor treatment and the practice of examining pregnant women nowadays. In order to meet the growing demands in the medical field, DFI SU968 provides a low-power 15W TDP with fanless design featuring and high-performance 6th generation Intel Core processor that supports high-resolution output to boost graphics capability in ultrasound application.
“Computer-On-Module is one of the popular choices for machine manufacturers and system integrators to design application-specific solutions. In order to reduce our customers’ development time and work, DFI provides time-to-market standard COM Express as well as OEM/ODM customized services, including module design assistance and evaluation during planning phase, strict validation and testing process for deployments, and customized COM Express thermal solution design for special requirements. With more than 34 years of professional experience in research, design and manufacture, DFI can handle those complex technical issues and become your reliable partner.” said Victor Huang, Product Manager at DFI.
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