Thank you for contacting Intel Embedded Community.
In order to be on the same page, could you please let us know if the affected device has been developed by you or a third-party company? In case it is a third-party device, could you please give us all the information related to it?
In case that it is your own design, could you please tell us if this thread is related to a technical problem? Please give us a detailed description of the problem.
Waiting for your reply to these questions.
The affected device is developed by third-party company and for your information, there is no issue with the processor itself.
The original intention of inquiring for the power consumption value during TAT application is to utilize the value in the thermal simulation for heat sink enhancement purpose only.
Looking forward to your feedback on the inquiry.
Thanks for your reply.
The information that may help you is stated in chapter 5, on pages 26, 27, and 28 of the Ivy Bridge Mobile Processor Thermal Design Guide for Embedded Applications document # 479739.
It is accessible when you are logged into your Resource & Design Center (RDC) privileged account. It can be requested by filling out the RDC Account Support form.
We hope that this information may help you.