0 Replies Latest reply on Nov 7, 2012 12:13 AM by Jerry_Portwell

    PORTWELL RELEASES A COMPACT COM EXPRESS MODULE EQUIPPED WITH 3RD GENERATION INTEL® CORE™ PROCESSOR

    Brown Belt
       

      PORTWELL RELEASES A COMPACT COM EXPRESS MODULE EQUIPPED WITH 3RD GENERATION INTEL® CORE™ PROCESSOR

      The New PCOM-B219VG Offers Higher Performance and More Accurate Responses for Medical Healthcare Systems, Military Equipment & Retail Systems


       

       

      2012-08-21 Taipei,Taiwan

       

      Portwell, Inc., a world-leading innovator in the Industrial PC (IPC) market and a Premier Member of the Intel® Intelligent Systems Alliance program today announces the release of the PCOM-B219VG, a Type 6 COM Express Compact (95mm x 95mm) module based on the 3rd generation Intel® Core™ processor and Mobile Intel® QM77 Express chipset (4.1W). The Com Express module includes Intel® Turbo Boost Technology for faster processing, Intel® vPro™ Technology for superior remote capabilities and Intel® Hyper-threading for multithreaded processing. Along with a USB 3.0, the PCOM-B219VG also utilizes the 3rd Generation Intel® Core Processor, built on 22nm process technology utilizing 3D Tri-gate transistor technology, resulting in 15% better performance and improved energy efficiency. These features translate into reduced manageability cost and improved security, making the PCOM-B219VG an ideal solution for Medical Healthcare Systems, Military Equipment and Retail Systems. 

       

      The compact PCOM-B219VG COM Express module supports up to 16GB ECC DDR3 1333/1600 MT/s SDRAM on two 204-pin SODIMM sockets making it faster than its predecessor. Its expansion interface supports one PCI Express x16 Gen3 (8.0GT/s) for enhanced video performance,1.6 times faster than the previous Gen2 (5.0GT/s), and seven PCI Express x1 Gen2 (5.0 GT/s).

       

      The module supports three independent displays, DP (Display Port), HDMI and DVI with up to 50% greater 3D performance compared to its previous generation. Running with a low TDP CPU, the PCOM-B219VG can provide superior performance in harsh environments from as low as -40 ℃ and up to 80 ℃.

       

      Performance, Versatile, Efficient, Faster Time to Market and Longevity

      Portwell clients know they can always count on us to provide them with a quality product and long term support with up to date know-how. Designed on a compact 95mm x 95mm platform, the PCOM-B219VG is backward compatible. In addition, the Mobile Intel® QM77Chipset functions smoothly with both 2nd generation and 3rd generation Intel Core processors. These features allow our customers to preserve their legacy components and subsequent investments while minimizing turn-around time – all of which ensures that the costs of inevitable upgrades are minimal.

       

      Design and Customization Services for Broad Applications

      In the Military and Medical sectors, safety with accuracy and precision are paramount, while in the Retail Market safeguarding investments by lowering costs of future designs is the status quo. As the markets change, Portwell’s versatile COM Express modules adapt to these changes by enabling designers to partition commodity host-processors from proprietary baseboards, thereby minimizing current and future design risks during the initial phase of development. This design of separating the CPU-upgradable module from system specific I/O carrier boards further safeguards development investments and lowers total cost of ownership. In addition, Portwell can also provide services to clients on the carrier board design and development, review schematics and BIOS customization. At Portwell, we strive to create superior products for our customers.